BeCe™ HPS Offers
Testing Solutions For :

  •  Large I/O, High Bandwidth, 112G + PAM4
  •  Combined Superiority In Mechanical, Thermal,
     Electrical & Signal Integrity Properties
BeCe™ HPS – High Performance Test Socket

BeCe’s low profile, high bandwidth with low inductance pin makes it an ideal contacting solution for testing of mobile communications, High speed digital and analog devices. A patented design braided spring probe technology that delivers low signal loss and supports BGA / LGA packages with pitches down to 0.35mm