BeCe, a Patented high-performace electrical contact, it’s low profile, high bandwidth with low inductance properties makes it an ideal contacting solution for High-speed digital and analog devices testing, and its performance is extendable.
BeCe™ Buttons with Micro-Wipe action provides excellent contact by breaking through oxide layers without visible marks and damage to the Solder balls.
Continuously evolving , BeCe™ with ultra fine wires is currently being developed to achieve lower contact force which is critical to wafer level testing.
Lists of Patents
- US 7,040,902
- US 7,029,288
- CN1 0046 8869C
- CN113207217A, Patent Pending